低功耗蓝牙智能灯控制模块晶振X1G005231000400
爱普生晶振TG5032CGN是一款温度补偿晶振,支持CMOS输出,小体积晶振尺寸5.0x3.2mm有源晶振,10脚贴片晶振,电源电压:2.375V至3.63V,频率范围:10MHZ至40MHZ,具有小体积轻薄型,低电源电压,低抖动,低功耗,低损耗,低耗能,低电平,低相位噪声特点,无铅,符合欧盟RoHS指令。应用于移动通讯,数码产品,车载数码,智能手机,蓝牙智能灯控制模块,数码相机,MID平板电脑,光电技术等通讯设备及各种频率控制设备。
低功耗蓝牙智能灯控制模块晶振X1G005231000400
产品编码 | 型号 | 频率 | 贴片晶振 | 输出波 | 电源电压 | 精度 | 工作温度 |
X1G005231000400 | TG5032CGN | 20.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231000500 | TG5032CGN | 24.576000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231000900 | TG5032CGN | 25.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001000 | TG5032CGN | 24.576000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001100 | TG5032CGN | 25.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001200 | TG5032CGN | 12.800000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001300 | TG5032CGN | 20.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001500 | TG5032CGN | 20.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001600 | TG5032CGN | 25.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001700 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231001900 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002000 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002300 | TG5032CGN | 25.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002500 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002600 | TG5032CGN | 40.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002700 | TG5032CGN | 40.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002800 | TG5032CGN | 20.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231002900 | TG5032CGN | 40.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003000 | TG5032CGN | 38.880000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003100 | TG5032CGN | 38.880000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003200 | TG5032CGN | 19.200000MHz | 5.00x3.20x1.45mm | CMOS | 2.700 to 3.000 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003300 | TG5032CGN | 19.200000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003400 | TG5032CGN | 20.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003500 | TG5032CGN | 25.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003600 | TG5032CGN | 19.440000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003700 | TG5032CGN | 30.720000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231003900 | TG5032CGN | 24.576000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004100 | TG5032CGN | 40.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004200 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004300 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004400 | TG5032CGN | 40.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004600 | TG5032CGN | 10.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004700 | TG5032CGN | 24.576000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004800 | TG5032CGN | 40.000000MHz | 5.00x3.20x1.45mm | CMOS | 2.375 to 2.625 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231004900 | TG5032CGN | 25.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to ++85 °C |
X1G005231005000 | TG5032CGN | 26.000000MHz | 5.00x3.20x1.45mm | CMOS | 3.135 to 3.465 V | +/-1.0ppm | -40 to +85 °C |
低功耗蓝牙智能灯控制模块晶振X1G005231000400
爱普生拓优科梦把半导体(IC)称之为“产业之米”,并认为晶体元器件更是离不开的“产业之盐”将进一步致力于小型,高稳定,高精度晶体元器件的开发,为现有的应用程序以及生活新蓝图开拓广阔前景.爱普生晶振在KHZ,MHZ,以及GHZ上都有重大突破,使得爱普生拓优科梦的晶体元器件已以23%的市场占有率位于业界第一.
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